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F2914 datasheet high reliability sp4t rf switch 50 mhz to 8000 mhz F2914, rev o 03/01/2016 1 ? 2016 integrated device technology, inc. g eneral d escription the F2914 is a high reliability, low insertion loss , 50 sp4t absorptive rf switch designed for a multitude of rf applications including wireless communications. this device covers a broad frequency range from 50 mhz to 8000 mhz. in addition to providing low insertion loss, the F2914 also delivers excellent linearity and isolation performance while providing a 50 termination to the unused rf input ports. the F2914 also includes a patent pending constant impedance (k z ) feature. k z improves system hot switching ruggedness, minimizes lo pulling in vcos, and reduces phase and amplitude variations in distribution networks. it is also ideal for dynami c switching / selection between two or more amplifier s while avoiding damage to upstream /downstream sensitive devices such as pas and adcs. the F2914 uses a single positive supply voltage supporting three logic control pins using either 3. 3 v or 1.8 v control logic. connecting a negative voltage to pin 20 disables the internal negative voltage gener ator and becomes the negative supply. c ompetitive a dvantage the F2914 provides constant impedance in all rf por ts during transitions improving a systems hotswitchi ng ruggedness. the device also supports high power handling, and high isolation; particularly importan t for dpd receiver use. constant impedance k k | | z z | | during switching transition rfx to rfc isolation = 50 db* insertion loss = 1.1 db* iip3: +60 dbm* extended temperature: 40 c to +105 c * 4 ghz a pplications ? base station 2g, 3g, 4g ? portable wireless ? repeaters and e911 systems ? digital predistortion ? point to point infrastructure ? public safety infrastructure ? military systems, jtrs radios ? cable infrastructure ? test / ate equipment f eatures ? four symmetric, absorptive rf ports ? high isolation: 50 db @ 4000 mhz ? low insertion loss: 1.1 db @ 4000 mhz ? high linearity: o iip2 of 114 dbm @ 2000 mhz o iip3 of 60 dbm @ 4000 mhz ? high operating power handling: o 33 dbm cw on selected rf port o 27 dbm on terminated ports ? single 2.7 v to 5.5 v supply voltage ? external negative supply option ? 3.3 v and 1.8 v compatible control logic ? operating temperature 40 c to +105 c ? 4 mm x 4 mm 24 pin qfn package ? pin compatible with competitors f unctional b lock d iagram control circuit rf4 rf2 rf1 v1 v2 v3 rfc 50 50 50 rf3 50 vss ext k | z | o rdering i nformation F2914nbgk8 green tape & reel
F2914 high reliability sp4t rf switch 2 rev o 03/01/2016 a bsolute m aximum r atings parameter symbol min max units v dd to gnd v dd 0.3 +6.0 v v1, v2, v3 to gnd v cntl 0.3 minimum ( 3.6, v dd + 0.3) v rf1, rf2, rf3, rf4, rfc to gnd v rf 0.3 +0.3 v vss ext to gnd v ext 4.0 +0.3 v input power for any one selected rf through port. (v dd applied @ 2ghz and t c = +85c) p maxthru 37 dbm input power for any one selected rf terminated port .(v dd applied @ 2ghz and t c = +85c) p maxterm 30 dbm input power for rfc when in the all off state. (v dd applied @ 2ghz and t c = +85c) p maxcom 33 dbm continuous power dissipation (t c = 95 c max) 3 w maximum junction temperature t jmax +140 c storage temperature range t st 65 +150 c lead temperature (soldering, 10s) t lead +260 c esd voltageC hbm (per jesd22a114) v esdhbm class 1c (1000 v) esd voltage C cdm (per jesd22c101) v esdcdm class iii (1000 v) t c = temperature of the exposed paddle stresses above those listed above may cause permane nt damage to the device. functional operation of th e device at these or any other conditions above those indicated in the operational section of this specification i s not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. p ackage t hermal and m oisture c haracteristics ja (junction C ambient) 41 c/w jc (junction C case) [the case is defined as the expos ed paddle] 6.4 c/w moisture sensitivity rating (per jstd020) msl1
rev o 03/01/2016 F2914 r ecommended o perating c parameter symbol supply voltage (s) v dd pin 20 grounded pin 20 driven with vss vss ext negative supply operating temp range t case exposed pad rf frequency range f rf rf continuous input cw power 2 p rf selected port terminated ports rf continuous input cw power for hot rf switching 2 p rfsw rfc as the input rf1 thru rf5 the inputs rf1 4 port impedance z rfx rfc port impedance z rfc note 1: fo r normal operation, connect vss by applying vss ext to pin 20, the negative voltage generator is disabl ed thereby completely eliminating any generator spurious responses. note 2: levels based on t c 85 c. see figure 1 power derating curve for higher ca se temperatures. note 3: in any of the insertion loss modes or switchi port paths can be each exposed to the maximum stated pow e switching operation. figure 1 - maximum rf input power vs. rf frequency 3 high reliability sp4t rf switch c onditions conditions min typ pin 20 grounded 2.7 pin 20 driven with vss ext 2.7 negative supply 1 3.6 3.4 exposed pad dle temperature 40 50 selected port terminated ports 3 rfc as the input switch to rf1 thru rf4. switched into or out of all off state. rf1 thru rf5 as the inputs switched to rfc or into term 3 . switch into or out of all off condition. 50 50 r normal operation, connect vss ext = 0 v (pin 20) to gnd to enable the internal negative v oltage generator. to pin 20, the negative voltage generator is disabl ed thereby completely eliminating any c. see figure 1 power derating curve for higher ca se temperatures. in any of the insertion loss modes or switchi ng into any insertion loss mode, the 3 remaining paths can be each exposed to the maximum stated pow e r level during continuous or hot maximum rf input power vs. rf frequency F2914 high reliability sp4t rf switch max units 5.5 v 5.5 3.2 +105 o c 8000 mhz 33 dbm 27 27 dbm 24 27 27 v (pin 20) to gnd to enable the internal negative v oltage generator. to pin 20, the negative voltage generator is disabl ed thereby completely eliminating any c. see figure 1 power derating curve for higher ca se temperatures. remaining terminated r level during continuous or hot
F2914 high reliability sp4t rf switch 4 rev o 03/01/2016 F2914 s pecification typical application circuit, normal mode (v dd = 3.3 v, vss ext = 0 v) or bypass mode (v dd = 3.3 v, vss ext = 3.3 v), t c = +25 c, f rf = 2000 mhz, input power = 0 dbm, z s = z l = 50 , rfx = one of the four input ports, pcb boar d trace and connector losses are deembedded unless o therwise noted. parameter symbol conditions min typ max units logic input high threshold v ih 1.1 minimum ( 3.6, v dd ) v logic input low threshold v il -0.3 0.6 v logic current i ih, i il for each control pin -2 +2 a dc current (v dd ) i dd normal mode 3.3 v or 1.8v logic 290 360 a bypass mode 3.3 v or 1.8v logic 270 340 dc current (vss ext ) i vss vss ext = 3.3 v 44 -60 a insertion loss rfx to rfc il 900 mhz 0.90 1.4 1 db 2100 mhz 1.1 1.5 2700 mhz 1.15 1.6 2700 mhz C 4000 mhz 1.2 1.65 2 4000 mhz C 8000 mhz 1.8 minimum isolation rfx to rfc isoc 400 mhz C 900 mhz 56 62.2 db 900 mhz C 2100 mhz 48.5 55.4 2100 mhz C 2700 mhz 48 53.5 2700 mhz C 4000 mhz 44 50 4000 mhz C 8000 mhz 29.5 35.7 minimum isolation rfx to rfx isox 400 mhz C 900 mhz 55 60.3 db 900 mhz C 2100 mhz 49.5 53.6 2100 mhz C 2700 mhz 47 52 2700 mhz C 4000 mhz 43 47.6 4000 mhz C 8000 mhz 29 36 maximum rfx port vswr during switching vswr t from rfx active to rfx term 1.7:1 from rfx term to rfx active 2:1 minimum return loss (rfc port ) rfc rl 400 mhz C 4000 mhz 15 db minimum return loss (rfx port ) rfx rl 400 mhz C4000 mhz active 13 db terminated 17 input 0.1db compression 3 icp 0.1db 35 dbm input ip2 iip2 f rf1 = 2000 mhz, f rf2 = 2010 mhz rf input = rfx, p in = +20 dbm / tone f rf1 + f rf2 term 114 dbm input ip3 iip3 ? f = 1 mhz rf input = rfx p in = +20 dbm / tone f rf = 2000 mhz 59.5 dbm f rf = 4000 mhz 60 switching time 4 t sw bypass mode 50% ctrl to 90% rf 256 345 ns 50% ctrl to 10% rf 256 345 50% ctrl to rf settled within +/ 0.1 db of i.l. value. 285 maximum switching rate 5 sw rate pin 20 = gnd 25 khz pin 20 = vss ext applied 290 maximum spurious level on any rf port 6 spur max rf ports terminated into 50? rfx connected to rfc 120 dbm note 1 C items in min/max columns in bold italics are guaranteed by test. note 2 C items in min/max columns that are not bold /italics are guaranteed by design characterization. note 3 C the input 0.1db compression point is a lin earity figure of merit. refer to absolute maximum r atings section for the maximum rf input power and figure 1 for maximum operating rf input power. note 4 C f rf = 1ghz. note 5 C minimum time required between switching of states =1/ (maximum switching rate). note 6 C spurious due to onchip negative voltage g enerator. typical generator fundamental frequency i s 2.2 mhz.
F2914 rev o 03/01/2016 5 high reliability sp4t rf switch table 1: 3-pin switch control truth table mode v3 v2 v1 rf4 on* 0 0 0 rf1 on 0 0 1 rf2 on 0 1 0 rf3 on 0 1 1 rf4 on 1 0 0 all off 1 0 1 all off 1 1 0 all off 1 1 1 * redundant state with state 100 table 2: 2-pin switch control truth table 1,2 mode v2 v1 rf4 on 0 0 rf1 on 0 1 rf2 on 1 0 rf3 on 1 1 note 1 pin 19 (v3) must be grounded for 2pin con trol. note 2 C 2pin control can be used if all off mod e is not required. typical operating conditions (toc) unless otherwise noted for the toc graphs on the fo llowing pages, the following conditions apply. ? v dd = 3.3 v. ? t case = +25 oc (t case = temperature of exposed paddle). ? f rf = 2000 mhz. ? rfx is the driven rf port and rfc is the output port. ? pin = 10 dbm for all small signal tests. ? pin = +15 dbm/tone applied to selected rfx port for two tone linearity tests. ? two tone frequency spacing = 5 mhz. ? z s = z l = 50 ohms. ? all unused rf ports terminated into 50 ohms. ? for insertion loss and isolation plots, rf trace and connector losses are de-embedded (see evkit board and connector loss plot). ? plots for isolation and insertion loss over temperature and voltage are for a typical path. for performance of a specific path, refer to the online s-p arameter file.
F2914 high reliability sp4t rf switch 6 rev o 03/01/2016 typical operating conditions (- 1 -) insertion loss vs. selected switch path insertion loss vs. voltage rfx rfc isolation vs. voltage insertion loss vs. temperature rfx rfc isolation vs. temperature rfx rfx isolation vs. temperature 3 2.5 2 1.5 1 0.5 0 0 1 2 3 4 5 6 7 8 insertion loss (db) frequency (ghz) rf1 rf2 rf3 rf4 3 2.5 2 1.5 1 0.5 0 0 1 2 3 4 5 6 7 8 insertion loss (db) frequency (ghz) 2.7v 3.3v 5.0v 5.5v 90 80 70 60 50 40 30 20 10 0 0 1 2 3 4 5 6 7 8 isolation (db) frequency (ghz) 2.7v 3.3v 5.0v 5.5v 3 2.5 2 1.5 1 0.5 0 0 1 2 3 4 5 6 7 8 insertion loss (db) frequency (ghz) 40c 25c 105c 90 80 70 60 50 40 30 20 10 0 0 1 2 3 4 5 6 7 8 isolation (db) frequency (ghz) 40c 25c 105c 110 100 90 80 70 60 50 40 30 20 10 0 0 1 2 3 4 5 6 7 8 isolation (db) frequency (ghz) 40c 25c 105c
F2914 rev o 03/01/2016 7 high reliability sp4t rf switch typical operating conditions (- 2 -) rfx rfx isolation vs. voltage rfx selected return loss vs. temperature rfc return loss vs. selected rfx port rfx return loss vs. selected rfx port rfx selected return loss vs. voltage rfc return loss with rfx selected vs. temperature 110 100 90 80 70 60 50 40 30 20 10 0 0 1 2 3 4 5 6 7 8 isolation (db) frequency (ghz) 2.7v 3.3v 5.0v 5.5v 40 30 20 10 0 0 1 2 3 4 5 6 7 8 return loss (db) frequency (ghz) 40c 25c 105c 40 30 20 10 0 0 1 2 3 4 5 6 7 8 return loss (db) frequency (ghz) rf1 rf2 rf3 rf4 40 30 20 10 0 0 1 2 3 4 5 6 7 8 return loss (db) frequency (ghz) rf1 rf2 rf3 rf4 40 30 20 10 0 0 1 2 3 4 5 6 7 8 return loss (db) frequency (ghz) 2.7v 3.3v 5.0v 5.5v 40 30 20 10 0 0 1 2 3 4 5 6 7 8 return loss (db) frequency (ghz) 40c 25c 105c
F2914 high reliability sp4t rf switch 8 rev o 03/01/2016 typical operating conditions (- 3 -) rfc return loss with rfx selected vs. voltage rfx terminated return loss vs. temperature return loss (during switching) vs. time rfx terminated return loss vs. rfx port rfx terminated return loss vs. voltage vswr (during switching) vs. time 40 30 20 10 0 0 1 2 3 4 5 6 7 8 return loss (db) frequency (ghz) 2.7v 3.3v 5.0v 5.5v 50 40 30 20 10 0 0 1 2 3 4 5 6 7 8 return loss (db) frequency (ghz) 40c 25c 105c 40 35 30 25 20 15 10 5 0 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 return loss time (sec) rfx term > rfx active rfx active > rfx term 50 40 30 20 10 0 0 1 2 3 4 5 6 7 8 return loss (db) frequency (ghz) rf1 rf2 rf3 rf4 50 40 30 20 10 0 0 1 2 3 4 5 6 7 8 return loss (db) frequency (ghz) 2.7v 3.3v 5.0v 5.5v 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 vswr time (sec) rfx term > rfx active rfx active > rfx term
F2914 rev o 03/01/2016 9 high reliability sp4t rf switch typical operating conditions (- 4 -) rfx switching time [rfx terminated to rfx active] rfx iip3 vs. selected rfx port evkit trace and connector loss vs. temperature rfx switching time [rfx active to rfx terminated] rfx iip3 vs. temperature and voltage 0.5 0.4 0.3 0.2 0.1 0 0.1 0.2 0.3 0.4 0.5 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 settling to il state (db) time (sec) 50% ctrl to insertion loss 0 10 20 30 40 50 60 70 0.5 1 1.5 2 2.5 3 3.5 4 iip3 (dbm) frequency (ghz) rf1 rf2 rf3 rf4 1.2 1 0.8 0.6 0.4 0.2 0 0 1 2 3 4 5 6 7 8 loss (db) frequency (ghz) 40c 25c 105c 70 60 50 40 30 20 10 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 settling to isolation (db) time (sec) 50% ctrl to isolation 0 10 20 30 40 50 60 70 0.5 1 1.5 2 2.5 3 3.5 4 iip3 (dbm) frequency (ghz) 40c, 2.7v 40c, 3.0v 40c, 3.3v 40c, 5.0v 40c, 5.5v 25c, 2.7v 25c, 3.0v 25c, 3.3v 25c, 5.0v 25c, 5.5v 105c, 2.7v 105c, 3v 105c, 3.3v 105c, 5v 105c, 5.5v
F2914 high reliability sp4t rf switch 10 rev o 03/01/2016 p ackage d rawing (4 mm x 4 mm 24pin qfn), nbg24 n ote : t he F2914 uses the p3 exposed paddle dimensions noted below
F2914 rev o 03/01/2016 11 high reliability sp4t rf switch l and p attern d imension land pattern to support 2.7 mm x 2.7 mm exposed paddle version (see version p3 of package drawing)
F2914 high reliability sp4t rf switch 12 rev o 03/01/2016 p in d iagram gnd vss e xt 1 4 3 2 5 gnd gnd gnd gnd gnd gnd vdd gnd control circuit e.p. 6 18 15 16 17 14 13 12 9 10 11 8 7 19 22 21 20 23 24 rf4 rf3 rf2 gnd rf1 gnd v1 v2 v3 gnd gnd gnd rfc 50 50 50 50 gnd p in d escription pin name function 1, 3, 4, 6, 7, 9, 10, 12, 13, 15, 21, 23, 24 gnd ground these pins as close to the device as pos sible. 2 gnd this pin is internally connected to the exposed pad dle. this pin can be left open or grounded. note: the evkit layout has a floating rf trace connected to this pin to make the board compatible with the f2915. 5 rf4 rf4 port. matched to 50 ohms. if this pin is not 0v dc, then an external coupling capacitor must be used. 8 rf3 rf3 port. matched to 50 ohms. if this pin is not 0v dc, then an external coupling capacitor must be used. 11 rf2 rf2 port. matched to 50 ohms. if this pin is not 0v dc, then an external coupling capacitor must be used. 14 rf1 rf1 port. matched to 50 ohms. if this pin is not 0v dc, then an external coupling capacitor must be used. 16 vdd power supply. bypass to gnd with capacitors shown i n the typical application circuit as close as possible to pin. 17 v1 control pin to set switch state. see table 1 or table 2. 18 v2 control pin to set switch state. see table 1 or table 2. 19 v3 control pin to set switch state. see table 1 or table 2. 20 vss ext external vss negative voltage control. connect to g round to enable on chip negative voltage generator. to bypass and disable o n chip generator connect this pin to an external vss. 22 rfc rf common port. matched to 50 ohms when one of the 4 rf ports is selected. if this pin is not 0v dc, then an external coupling capacitor must be used. 25 ep exposed pad. internally connected to gnd. solder th is exposed pad to a pcb pad that uses multiple ground vias to provide heat transfer out of the device into the pcb ground planes. these multiple ground v ias are also required to achieve the specified rf performance.
F2914 rev o 03/01/2016 13 high reliability sp4t rf switch a pplications i nformation default start-up control pins include no internal pulldown resistor s to logic low or pullup resistors to logic high. logic control three control pins v1, v2, and v3 are used to set t he state of the sp4t switch (see table 1 or table 2 ). external vss the F2914 is designed with an onchip negative volt age generator. this onchip generator is enabled b y connecting pin 20 of the device to ground. to disab le the onchip generator apply a negative voltage t o pin 20 (vssext) of the device within the range stated in t he recommended operating conditions table. power supplies a common vdd power supply should be used for all pi ns requiring dc power. all supply pins should be bypassed with external capacitors to minimize noise and fast transients. supply noise can degrade nois e figure and fast transients can trigger esd clamps and caus e them to fail. supply voltage change or transients should have a slew rate smaller than 1v/20us. in addition , all control pins should remain at 0 v (+/0.3 v) while the supply voltage ramps or while it returns to zero. control pin interface if control signal integrity is a concern and clean signals cannot be guaranteed due to overshoot, unde rshoot, ringing, etc., the following circuit at the input o f each control pin is recommended. this applies to control pins 17, 18, and 19 as shown below.
F2914 high reliability sp4t rf switch 14 rev o 03/01/2016 e v k it p icture top view bottom view
F2914 rev o 03/01/2016 15 high reliability sp4t rf switch ev kit / a pplications c ircuit
F2914 high reliability sp4t rf switch 16 rev o 03/01/2016 evk it bom part reference qty description mfr. part # mfr. c1, c3, c5, c7, c8, c9 6 100 pf 5%, 50v, c0g ceramic capacitor (0402) grm 1555c1h101j murata c2 0 not installed (0603) c4 0 not installed (0603) c6 1 1000 pf 5%, 50v, c0g ceramic capacitor (0603) grm1885c1h102j murata r1, r2, r3 3 0 ? 1%, 1/10w, resistor (0402) erj 2ge0r00x panasonic r4, r5, r6 3 100 k ? 1%, 1/10w, resistor (0402) erj 2rkf1003 x panasonic r7 1 15 k ? 1%, 1/10w, resistor (0402) erj 2rkf1502x panasonic r8 1 22 k ? 1%, 1/10w, resistor (0402) erj 2rkf 22 02x panasonic j1 , j3 j8 7 edge launch sma (0.375 inch pitch ground tabs) 142 0701 851 emerson johnson j9 1 conn header vert dbl 10 x 2 pos gold 67997 120hlf fci u1 1 sp4 t switch 4 mm x 4 mm qfn24 ep F2914 nb g k idt 1 printed circuit board f29xx evkit rev 02.0 idt t op m arkings idtF2914 nbgk z1528acl part number date code [yyww] (week 28 of 2015) asm test step assembler code
F2914 rev o 03/01/2016 17 high reliability sp4t rf switch ev kit o peration external supply setup set up a vdd power supply in the voltage range of 2 .7 v to 5.5 v and disable the power supply output. if using the onchip negative voltage generator ins tall a 2pin shunt to short out pins 3 and 4 of j9. if an external negative voltage supply is to be use d set the supply voltage within the range of 3.6 v to 3.2 v and disable the negative voltage power suppl y output. also, be sure there are no jumper connections on pins 3 and 4 of j9. logic control setup using the evkit to manually set the control logic: on connector j9 connect a 2pin shunt from pin 7 (v dd) to pin 8 (vdd_ctrl). this connection provides the vdd voltage supply to the eval board logic cont rol pull up network. on connector j9 connect a 2pin shunt from pin 9 (l vsel2) to pin 10 (lvsel). this connection enables r 7 (15 k?) and r8 (22 k?) to form a voltage divider to set the proper logic control levels to support the full voltage range of vdd. note that when using the onb oard r7 / r8 voltage divider the current draw from the vdd supply will be higher by approximately vdd / 37 k. connector j9 has 3 logic input pins: v1 (pin 20), v 2 (pin 18), and v3 (pin 16). see table 1 or table 2 for logic truth table. with the pullup network enabled (as noted above), these pins open will provide a lo gic high through pull up resistors r4, r5, and r6. to s et a logic low to v1, v2, and v3 connect 2pin shun ts from pin 16 to pin 15, pin 18 to pin 17 and pin 20 to pin 19 respectively. using external control logic: pins 6, 7, 8, 9, and 10 of j9 should have no connec tion. external logic controls would be applied to j 9 pins 16 (v3) , 18 (v2) and 20 (v1). see table 1 or table 2 for logic truth table. turn on procedure setup the supplies and eval board as noted in the external supply setup and logic control setup sections above. connect the preset disabled vdd power supply to pin 2 (vdd) and pin 1 (gnd) of j9. if the external negative voltage source is to be us ed, connect the disabled supply to pin 4 (vssext) a nd pin 3 (gnd) of j9. if using onchip negative supply be sure the 2pin shunt is installed connecting pi n 3 to pin 4. enable the vdd supply then enable the vssext supply (if used). set the desired logic setting using v1, v2, and v3 to achieve the desired table 1 or table 2 setting. note that external control logic should not be applied w ithout vdd being applied first. turn off procedure if using external control logic for v1, v2, v3 then set to a logic low. disable any external vssext supply. disable the vdd supply.
F2914 high reliability sp4t rf switch 18 rev o 03/01/2016 r evision h istory s heet rev date page description of change o 2016mar01 production release
F2914 rev o 03/01/2016 19 high reliability sp4t rf switch corporate headquarters 6024 silver creek valley road san jose, ca 95138 usa sales 1-800-345-7015 or 408-284-8200 fax: 408-284-2775 www.idt.com tech support http://www.idt.com/support/technical-support disclaimer integrated device technology, inc. (idt) reserves the right to modify the products and/or sp ecifications described herein at any time, without notice, at idts sole discretion. performance specifications and operating parameters of the described products are determined in an ind ependent state and are not guaranteed to perform th e same way when installed in customer products. the information contained herein is prov ided without representation or warranty of any kind , whether express or implied, including, but not li mited to, the suitability of idts products for any particular purpose, an implied warranty of merc hantability, or noninfringement of the intellectua l property rights of others. this document is pres ented only as a guide and does not convey any license under intellectual property rights of idt o r any third parties. idts products are not intended for use in applicat ions involving extreme environmental conditions or in life support systems or similar devices where th e failure or malfunction of an idt product can be reasonably expected to significantly affect the health or safety of users. anyone using an idt pro duct in such a manner does so at their own risk, ab sent an express, written agreement by idt. integrated device technology, idt and the idt logo are trademarks or registered trademarks of idt and its subsidiaries in the united states and other cou ntries. other trademarks used herein are the property of idt or their respective third party owners. copyright ?2015. integrated device technology, inc. all rights reserved.

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